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Project context
The China Shaanxi Coal Group Research Institute has developed automated cutting technology for 1mm and 2mm thermal silicon wafers.
Device Overview
This 40K ultrasonic system is designed for cutting thermal conductive silicon wafers, requiring an operational precision error of only 0.05 mm during the cutting process.
Device Diagram
Video Demonstration
Plant parameter
| Total Technical Parameters | Vibration Component Parameters | Assembling components and materials |
| Specification Model: HC-XCK40GD | Transducer: Piezoelectric ceramic/imported aluminum | Cooling method: Air cooling |
| Total Power: 100 W | Amplitude rod: High-quality aviation-grade aluminum | Maximum operating temperature: 0–45°C |
| Operating frequency: 40.0 ± 1 kHz | Tool head: Titanium alloy | Maximum allowable pressure: atmospheric pressure |
| Input Voltage: 220V/50Hz | Fixed flange / Protective housing: Aluminum alloy |
